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| 2 Channel Headset Speaker EMI Filter with ESD Protection CSPEMI201AG Features * * * * * * * * * Two channels of EMI filtering Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network Greater than 40dB attenuation at 1GHz +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection in each channel (HBM) Supports AC signals--ideal for audio applications Extremely low lead inductance for optimum filter and ESD performance 5-bump, 0.930mm X 1.410mm footprint Chip Scale Package (CSP) RoHS compliant (lead-free) finishing Product Description The CSPEMI201AG is a dual low-pass filter array integrating two pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom-designed to interface with a speaker port on a cellular telephone or similar device. Each high quality filter provides more than 35dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from a speaker element. They also support bipolar signals with a cutoff frequency of 31MHz, enabling audio signals to pass through without distortion. In addition, the CSPEMI201AG provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The CSPEMI201AG can safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CSPEMI201AG is particularly well-suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package and low weight. The CSPEMI201AG is available in a space-saving, low-profile Chip Scale Package with RoHS compliant lead-free finishing. Applications * * * * * * * EMI filtering and ESD protection for headset speaker ports Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs (c)2010 SCILLC. All rights reserved. April 2010 Rev. 3 Publication Order Number: CSPEMI201AG/D CSPEMI201AG Electrical Schematic Rev. 3 | Page 2 of 9 | www.onsemi.com CSPEMI201AG PIN DESCRIPTIONS PIN A1 A3 B2 C1 C3 NAME SPKR_IN1 SPKR_IN2 GND SPKR_OUT1 SPKR_OUT2 DESCRIPTION Speaker Input 1 (from audio circuitry) Speaker Input 2 (from audio circuitry) Device Ground Speaker Output 1 (to speaker) Speaker Output 2 (to speaker) Ordering Information PART NUMBERING INFORMATION Pins 5 Package CSP Ordering Part Number1 CSPEMI201AGG Part Marking AB Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Rev. 3 | Page 3 of 9 | www.onsemi.com CSPEMI201AG Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 200 UNITS C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C Rev. 3 | Page 4 of 9 | www.onsemi.com CSPEMI201AG ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL R C ILEAK VSIG PARAMETER Resistance Capacitance Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency ZSOURCE = 50, ZLOAD = 50 VIN=5.0V ILOAD = 10mA 5 -15 Note 2 15 8 Notes 2 and 3 +15 -19 R = 10, C = 100pF 31 V V MHz kV kV 7 -10 15 -5 V V CONDITIONS MIN 9 80 TYP 10 100 MAX 11 120 1.0 UNITS pF A VESD VCL fC Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Rev. 3 | Page 5 of 9 | www.onsemi.com CSPEMI201AG Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2) Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2) Rev. 3 | Page 6 of 9 | www.onsemi.com CSPEMI201AG Application Information PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260C N on-Solder M ask D efined Pad 0.240m D m IA. Solder Stencil Opening 0.300m D m IA. Solder Mask Opening 0.290m D m IA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 3 | Page 7 of 9 | www.onsemi.com CSPEMI201AG Mechanical Details CSP Mechanical Specifications The CSPEMI201AG is available in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Nom Max BOTTOM VIEW A1 C1 B2 B1 C A2 B A B4 B3 Custom CSP 5 Inches 0.885 0.930 0.975 0.0348 0.0366 0.0384 1.365 1.410 1.455 0.0537 0.0555 0.0573 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 123 SIDE VIEW C2 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.165 0.215 0.265 0.0065 0.0085 0.0104 0.220 0.270 0.320 0.0087 0.0106 0.0126 0.562 0.606 0.650 0.0221 0.0239 0.0256 0.356 0.381 0.406 0.0140 0.0150 0.0160 3500 pieces D1 0.30 DIA. 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) D2 SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI201AG Chip Scale Package # per tape and reel Controlling dimension: millimeters Rev. 3 | Page 8 of 9 | www.onsemi.com CSPEMI201AG CSP Tape and Reel Specifications POCKET SIZE (mm) TAPE WIDTH B0 X A0 X K0 W 1.52 X 1.07 X 0.72 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 PART NUMBER CHIP SIZE (mm) P0 4mm P1 4mm CSPEMI201AGG 1.41 X 0.93 X 0.606 + + + Figure 5. Tape and Reel Mechanical Data ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative Rev. 3 | Page 9 of 9 | www.onsemi.com |
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